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Editorial board

Darius Andriukaitis
Kaunas University of Technology, Lithuania

Alexander Argyros
The University of Sydney, Australia

Radu Arsinte
Technical University of Cluj Napoca, Romania

Ivan Baronak
Slovak University of Technology, Slovakia

Khosrow Behbehani
The University of Texas at Arlington, United States

Mohamed El Hachemi Benbouzid
University of Brest, France

Dalibor Biolek
University of Defence, Czech Republic

Klara Capova
University of Zilina, Slovakia

Erik Chromy
UPC Broadband Slovakia, Slovakia

Milan Dado
University of Zilina, Slovakia

Petr Drexler
Brno University of Technology, Czech Republic

Eva Gescheidtova
Brno University of Technology, Czech Republic

Ray-Guang Cheng
National Taiwan University of Science and Technology, Taiwan, Province of China

Gokhan Hakki Ilk
Ankara University, Turkey

Janusz Jezewski
Institute of Medical Technology and Equipment, Poland

Rene Kalus
VSB - Technical University of Ostrava, Czech Republic

Ivan Kasik
Academy of Sciences of the Czech Republic, Czech Republic

Jan Kohout
University of Defence, Czech Republic

Ondrej Krejcar
University of Hradec Kralove, Czech Republic

Miroslaw Luft
Technical University of Radom, Poland

Stanislav Marchevsky
Technical University of Kosice, Slovakia

Byung-Seo Kim
Hongik University, Korea

Valeriy Arkhin
Buryat State University, Russia

Rupak Kharel
University of Huddersfield, United Kingdom

Fayaz Hussain
Ton Duc Thang University, Vietnam

Peppino Fazio
Ca’ Foscari University of Venice, Italy

Fazel Mohammadi
University of New Haven, United States of America

Thang Trung Nguyen
Ton Duc Thang University, Vietnam

Le Anh Vu
Ton Duc Thang University, Vietnam

Miroslav Voznak
VSB - Technical University of Ostrava, Czech Republic

Zbigniew Leonowicz
Wroclaw University of Science and Technology, Poland

Wasiu Oyewole Popoola
The University of Edinburgh, United Kingdom

Yuriy S. Shmaliy
Guanajuato University, Mexico

Lorand Szabo
Technical University of Cluj Napoca, Romania

Tran Trung Duy
Posts and Telecommunications Institute of Technology, Ho Chi Minh City, Vietnam

Xingwang Li
Henan Polytechnic University, China

Huynh Van Van
Ton Duc Thang University, Vietnam

Lubos Rejfek
University of Pardubice, Czech Republic

Neeta Pandey
Delhi Technological University, India

Huynh The Thien
Ho Chi Minh City University of Technology and Education, Vietnam

Mauro Tropea
DIMES Department of University of Calabria, Italy

Gaojian Huang
Henan Polytechnic University, China

Nguyen Quang Sang
Ho Chi Minh City University of Transport, Vietnam

Anh-Tu Le
Ho Chi Minh City University of Transport, Vietnam

Phu Tran Tin
Ton Duc Thang University, Vietnam


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Dear valued readers, esteemed authors, respected reviewers, and distinguished colleagues,

We express our sincere gratitude for your unwavering support of the Advances in Electrical and Electronic Engineering (AEEE) journal.

In a dedicated effort to enhance the overall quality of the journal, as well as to improve the experience for authors and reviewers engaged in the submission and review process for manuscripts submitted to the AEEE, we encourage you to explore the updated information available on the journal's website. It is our pleasure to announce that we will transition to a new submission platform on 15th March, 2024. We firmly believe that the innovative platform will provide a comprehensive and seamless experience for all stakeholders.

Furthermore, to perpetuate the enhancements achieved through the implementation of the new platform and to fortify the quality of manuscript services, we wish to inform you that, effective from 15th March, 2024, manuscripts submitted and accepted will be subject to a mandatory Article Processing Charge (APC) of 250 euros.


Transition period from now to 15th March, 2024:
During the transition period, encompassing the period from now until 15th March, 2024, no changes will be implemented. Authors are welcome to submit their manuscripts, including both novel manuscripts and revised manuscripts, using the current platform, i.e., OJS. Additionally, decisions and comments will continue to be communicated through the existing platform during this timeframe.


Commencing 15th March, 2024:
Commencing 15th March, 2024, all review processes will transition to the novel platform, with the exception of manuscripts currently under review. The detailed instructions for each scenario are provided below
:

Guidelines for novel submission:
To submit a novel manuscript, authors may adopt either of the following approaches:

1. Click Here - This direct link leads to the novel platform, Manuscript Manager. Please find below the attached file that provides instructions on creating an account on the novel platform, along with a step-by-step guide for submitting a novel manuscript.


2. Sign in to the AEEE website with your existing account (If you do not have an account yet, we kindly ask you to use the above approach.) On your profile home page (User home), click on [New submission]. This will also redirect you to the novel platform, Manuscript Manager. Please refer to the attached file for guidance on creating an account and submitting a novel manuscript.


Guidelines for under review manuscript:
All manuscripts currently under review will persist in utilizing the existing platform until a decision is rendered. In cases where the decision is Resubmit for Revise or Minor Revision, authors are required to incorporate the recommended changes from the reviewers and subsequently submit the revised manuscript using the novel platform. The guidelines for novel submission are provided above.


Guidelines for the under-revision manuscript:
Manuscripts under revision, such as those marked for Resubmit for Revise or Minor Revision, should be resubmitted via the novel platform. Authors are kindly requested to explicitly state in the cover letter during the resubmission process that their submission represents the revised version of the prior manuscript with the ID [Manuscript_ID]. The guidelines for novel submission are detailed above.

This transition aims to streamline and enhance the submission and review processes for the AEEE journal.

Your understanding and cooperation during this transition period are greatly appreciated.

We deeply appreciate your ongoing support and cooperation.

Please download the author guidelines Author Guidelines

Kind regards,
AEEE Editorial Board